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HomeExclusive-China readying $143 billion package for its chip firms in face of U.S. curbs -sourcesFILE PHOTO: A researcher plants a semiconductor on an interface

FILE PHOTO: A researcher plants a semiconductor on an interface

FILE PHOTO: A researcher plants a semiconductor on an interface board during a research work to design and develop a semiconductor product at Tsinghua Unigroup research centre in Beijing, China, February 29, 2016. REUTERS/Kim Kyung-Hoon/File Photo
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